Wedge Wirebonder

For wire bonding of devices we use manual wedge bonders from West Bond and Kulicke & Soffa. The bonding principle is pressing under ultrasonic power. Our experience covers mainly bonding of Au-wires to Au, Al, or Cu bonding pads.


Kulicke & Soffa Model 4523AD

Bonding tools for gold wire diameters of 25µm are available. Semi automatic bonding is possible. The temperature of the sample is controllable by and a Temperature controller up to 250°C.

Specifications:
Wire diameters: 25 microns
Wire materials: Au, Al
Bond force: 10 to 160grams
Ultrasonic power time: 10ms up to 1000 ms
Bonding area: 134 x 134 mm

West Bond Model 7400B

Bonding tools for gold wire diameters of 18 and 25µm are available. Standard bonding method is 45° wire feed, clamps behind the tool and traditional wedge-wedge. The temperature of the sample is controllable by and a Temperature controller, West Bond Model 1200D and a thermochuck. A digital front panel allows an easy temperature control up to 400°C. A heated platform of 40mm diameter is in disposition for possible under-pressure attachment of wafer pieces or for mounting of special sample holders.

Specifications:
Wire diameters: 18 and 25 microns
Wire materials: Au, Al
Bond force: 10 to 100grams